Our Technical Packaging Leadership Consortium


In January of 2008, Unisource Global Solutions (UGS) organized and sponsored an assembly of the leading representatives in the Packaging Technology industry.  At this conference, those in attendance participated in an ESD Workshop/Certification course taught by Mr. Bob Vermillion, CPP/Fellow.  Experts from the fields of Electronics, Medical and Pharmaceutical also came together to share best practices.

The focus of the UGS Conference was Packaging Testing and Field Data Collection - including the correlation between these two areas – and how to mitigate issues encountered.  The forum resolved issues raised and answered questions posed by the attendees.  It also offered discussions centered on problem solving, cross-functional sharing, and provided help needed and synergistic standardization to the appropriate issue or industry.

Building on the success of our first Consortium, UGS looks forward to our next conference and hopes to offer this event annually.  Check back for updates.

2008 UGS Technical Packaging Leadership Consortium Attendees included:

  • Clemson University
  • Graph Comm Holdings International, Inc
  • Hewlett-Packard Co.
  • IBM
  • RR Donnelley
  • Lansmont Corp.
  • Xerox Corp.
  • Zune
  • Entegris
  • True North Associates, LLC
  • Ingram Micro
  • Applied BioSystems
  • GE Healthcare Technologies
  • RMV Technology Group, LLC